For those engaged in the LED chip light bead industry, it is necessary to understand the packaging of LED chip light beads. So, what is the packaging process of LED chip light beads?
When packaging LED chip chips, we should first choose the appropriate size, luminous rate, color, voltage, and current for the LED chip packaging. The following is a detailed description:
1. Expansion, using an expansion machine to uniformly expand the entire LED chip film provided by the manufacturer, causing the tightly arranged LED grains attached to the surface of the film to be pulled apart, facilitating crystal piercing.
2. Back glue, place the expanded crystal ring on the back glue machine surface that has been scraped with silver paste layer, and back the silver paste. Point silver paste. Suitable for bulk LED chips. Use a glue dispenser to apply an appropriate amount of silver paste onto the PCB printed circuit board.
3. Solid crystal, place the prepared silver paste expansion ring into the crystal piercing rack, and have the operator pierce the LED chip onto the PCB printed circuit board with a crystal piercing pen under the microscope.
4. To fix the crystal, place the PCB printed circuit board with the crystal on it in a hot cycle oven and let it stand at a constant temperature for a period of time. After the silver paste solidifies, remove it (do not leave it for too long, otherwise the LED chip coating will turn yellow and oxidize, causing difficulties in bonding). If there is LED chip bonding, the above steps are required; If only the IC chip is bonded, cancel the above steps.
5. Wire bonding, using an aluminum wire bonding machine to bridge the chip with the corresponding aluminum wire pads on the PCB board, that is, the inner leads of COB are soldered.
6. For initial testing, use specialized testing tools (with different equipment for COB according to different purposes, simply high-precision stabilized power supply) to test COB boards, and rework any boards that do not meet the requirements.
7. Glue dispensing, using a glue dispensing machine to apply an appropriate amount of AB glue onto the bonded LED chips. The IC is then encapsulated with black glue and visually packaged according to customer requirements.
8. Curing: Place the sealed PCB printed circuit board or lamp holder in a thermal cycling oven at a constant temperature, and set different drying times according to requirements.
9. Overall testing involves conducting electrical performance tests on packaged PCB printed circuit boards or light fixtures using specialized testing tools to distinguish between good and bad.
10. Spectral analysis, use a spectrophotometer to distinguish the brightness of lamps with different brightness levels according to requirements, and package them separately.
11. After entering the warehouse, we will mass export to create a comfortable LED light bead packaging and energy-saving lifestyle for everyone.
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